Kualitas Papan Partikel dari Limbah Partikel Kayu Meranti Merah (Shorea leprosula) Menggunakan Perekat Gambir-Sukrosa

Abstract

Wood particle waste is the remaining wood or wood parts that are considered to have no economic value in a certain process, at a certain time and in a certain place that may still be utilized in a different process and time. Sawmill waste in Indonesia in 2020 reaches 1.4 million m³ per year with a total wood production of 2.6 million m³ per year. Red meranti wood particle waste has the potential to be used as particleboard without synthetic adhesives. The utilization of red meranti wood particle waste is still limited to furniture and household handicraft industries and has not been processed into technological products. One alternative binder can be derived from plant-based materials, namely gambier-based tannins. Sucrose is a natural material that has potential as a natural adhesive to replace formaldehyde-based synthetic adhesives. This study aims to analyze the physical and mechanical properties of red meranti particleboard using gambir-sucrose adhesive and analyze the effect of adhesive ratio factor and felt temperature on the physical and mechanical properties of red meranti particleboard. This research method refers to the Japanese Industrial Standard (JIS) A 5908 (2003) with a board size of 25 x 25 x 1 cm. The adhesive used was gambier-sucrose adhesive with two treatment factors: adhesive ratio (25/75, 50/50, 75/25) and felt temperature (180℃, 200℃), 30% adhesive content, and 35 Mpa felt pressure for 15 minutes with 3 replications. 1. The results of testing the physical and mechanical properties with an adhesive ratio of 25/75, a forging temperature of 180 ℃ obtained a density value of 0.53-0.59 gr/cm³, moisture content of 7.14-8.96%, water absorption of 162.09-206.17%, thickness development of 36.65-66.95%, Modulus of Elasticity 0.11-0.16 kgf/cm², Modulus of rupture 0.34-1.71 kgf/cm² and internal bond 0.01-0.04 kgf/cm². Based on JIS (Japanese Industrial Standard) A 5908 (2003) standard. Gambir-sucrose adhesive on red meranti particleboard with the best treatment is with gambir/sucrose (G/S) adhesive ratio of 25/75 and felt temperature of 180℃. Particleboard properties meet the standards on density, moisture content and thickness development with a gambir/sucrose (G/S) adhesive ratio of 25/75 with a felt temperature of 200 ºC which meets and is close to the standard value.