Optimasi Proses Pembuatan Papan Partikel Berbahan Campuran Limbah Daun Singkong dan Bambu Belangke

Abstract

Waste of cassava leaves are an organic waste with a lignocellulose that has the potential to be an alternative raw material for particleboard. Its utilization can be a solution to the limited wood supply caused by increasing deforestation rates. This study aims to optimize the particleboard manufacturing process from waste of cassava leaves by varying the isocyanate adhesive content, pressing temperature, and number of fiberglass reinforcement layers. Waste of cassava leaves is used as an alternative source of lignocellulose to replace wood, with the addition of shavings of belangke bamboo (Gigantochloa pruriens) as reinforcement. The study was conducted in three stages: (I) varying the adhesive content of 4%, 6%, and 8%; (II) varying the pressing temperature of 130–170°C; and (III) varying the number of fiberglass layers (4, 8, and 12 sheets) on the permukaan of the board with a board size of 25x25x1 cm. Particleboard samples were tested for physical, mechanical, and microscopic properties. The results of the board testing were physical properties including density ranging from 0,50-0,53g/cm3 (in phase I), 0,57-0,61g/cm3 (in phase II), 0,57-0,81g/cm3 (in phase III), moisture content ranging from 8,45-9,02g/cm3 (in phase I), 6,90-9,75g/cm3 (in phase II), 3,77- 7,54g/cm3 (in phase III), water absorption ranging from 20,56-51,84% (in phase I), 39,50- 48,96% (in phase II), 22,55-49,11% (in phase III), thickness swelling ranging from 8,92-26,20 (in phase I), 39,50-48,96 (in phase II), 8,86-11,46 (in phase III) and mechanical properties include MOE ranging from 3.745-5.138 (in phase I), 5.992-12.543 (in phase II), 8.561-36.713 kgf/cm2 (in phase III), MOR ranging from 30,2- 45,4 kgf/cm2 (phase I), 45,89-84,28 kgf/cm2 (phase II), 84,09- 176,34 kgf/cm2 (phase III) and IB ranging from 0,37-0,95 (in phase I), 0,31-1,27 (in phase II), 0,54-0,73 (in phase III). Optimization of adhesive content, pressing temperature, and fiberglass layers was conducted to achieve stronger internal bonding, optimal curing, and improved surface reinforcement. These factors directly enhance the physical and mechanical properties of the particleboard to meet quality standards. The highest values in the physical and mechanical properties tests were obtained from the boards treated with 8% adhesive content, a pressing temperature of 160°C, and the application of 12 layers of fiberglasS.