Karakterisasi dan Beban Limbah Cair Proses Pelarutan Lapisan Tembaga (Pengetsaan ) Printed Circuit Board (PCB) sebagai Papan Perakitan Komponen Elektronika

Abstract

Research of background by : requirement upgrading envitonment in Technical Teacher Upgrading Center (TTUC) Medan and because not yet contained of wastewater process etching of PCB in number environment state ministrial decree : Kep-51/MENLH/ 10/1995. Research aim to to know contamination burden and characteristic from each etching process using 3 materials type etch different that is FeCl3:, HNO3 and HCI + H2O2, also determine materials etch friendly of environment. The experiment conducted in TTUC Medan by using equipments laboratory scale and chemical parameters analysis in analytic chemical laboratory. Checked by chemisty parameter is : TDS, TSS, pH, Fe and Cu. Data processed with statistic and analysed to determine wastewater characteristic is and also calculated by contamination burden and debit to determine quality of wastewater process etching of materials type and PCB etch friendly of environment by using formula in D enclosure from number kepmen : Kep-51/MENLH/ 10/1995. Experiment conducted with PCB photoprinted beforehand, later ; then including it into pail which is have containing code of materials condensation etch. Amount of pail is 18 because materials etch which checked by there is 3 type and each; every experiment type repeated by counted 6 times. From research obtained that wastewater charateristic process etching of PCB with materials etch FeCl3, HNO3 and HCI + H2O2, contain colour, having the character of is corrosive, containing heavy metal, high valuable dissolve solid and suspended solid high vaaluable also, that contamination burden in fact from wastewater process etching of PCB in TTUC Medan not yet is abysmal of standard value of quality, becaused etched by PCB is mean every day 150 keping or is equal to 1,5 PCB sheet of the size 2 m x I m ( assess BPA smaller than BPM ), that process etching of PCB by using materials etch HCI + H2O2, frendlier of environment because maximum contamination burden value of compared to lower TDS, TSS, Fe and Cu parameter of materials etch is other, that process etching of PCB by using materials etch HCI + H2O2, more is productive compared to HNO3 and also FeCl3, seen from amount of PCB be etched, that TS parameter value TDS and Cu wastewater process etching of PCB with materials etch HCI + H2O2, compared to bigger materials etch is other, because wide of bigger dissolve copper coat, that pH parameter value, TS, TDS, TSS, Fe and Cu wastewater process etching of PCB with three matedals type etch to exceed standard value of quality of is set in Kep-51/MENLH/ 10/1995 C enclosure about standard quality of wastewater to industrial activity.