dc.contributor.advisor | Daulay, Saipul Bahri | |
dc.contributor.advisor | Rizaldi, Taufik | |
dc.contributor.author | Malau, Krisna Margaretta | |
dc.date.accessioned | 2022-11-03T04:37:38Z | |
dc.date.available | 2022-11-03T04:37:38Z | |
dc.date.issued | 2010 | |
dc.identifier.uri | https://repositori.usu.ac.id/handle/123456789/53182 | |
dc.description.abstract | A new panel product from sugar waste industry like as bagasee has made
using adhesives Urea Formaldehyde (UF). The boards were pressed at amount of
pressure 25 kg/cm2 and at temperature of 1400
. Levels of adhesives used were
10% and 12% of dry-weight particles and additive liquid wax were varied at 0%,
1% and 2 % of dry-weight. The physical and mechanical properties of the boards
were tested in accordance with JIS A 5908-2003 standard. The density value,
moisture content and water absorption were met with the JIS A 5908-2003
standard, while value of the mechanical properties i.e internal bond and modulus
of elasticity.
Results showed that effects of level of adhesives were very significant to
the density value and modulus of rupture tested. While effects of levels of liquid
wax were very significant to the moisture content, thickness swelling , modulus of
elasticity and internal bond tested. The effects of interaction of the levels of
adhesives and liquid wax were very significant to the moisture content and
significant to the modulus of rupture tested. | en_US |
dc.language.iso | id | en_US |
dc.publisher | Univeritas Sumatera Utara | en_US |
dc.subject | Particle Board | en_US |
dc.subject | adhesives Urea Formaldehyde (UF) | en_US |
dc.subject | Liquid Wax | en_US |
dc.subject | Physical Properties and Mechanical Propertie | en_US |
dc.title | Pemanfaatan Ampas Tebu sebagai Bahan Baku dalam Pembuatan Papan Partikel | en_US |
dc.identifier.nim | NIDN0017067503 | |
dc.identifier.nim | NIM040308040 | |
dc.identifier.nidn | NIDN0028086206 | |
dc.identifier.kodeprodi | KODEPRODI41201#Keteknikan Pertanian | |
dc.description.pages | 89 Halaman | en_US |
dc.description.type | Skripsi Sarjana | en_US |