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    Pengaruh Suhu dan Waktu Kempa pada Penyediaan Papan Partikel dari Serbuk Kayu Pohon Sengon (Paraserianthes Falcataria L) dengan Perekat Gondorukem melalui Metode Pencetakan Kempa

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    Date
    2023
    Author
    Nuriyani, Nuriyani
    Advisor(s)
    Halimatuddahliana
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    Abstract
    This research was conducted to determine the most optimal temperature and time for the characteristics, physical and mechanical properties of particle board with gondorukem adhesive through the pressing method using hot press. This research was conducted in several stages, namely the preparation of sengon wood particles, the manufacture of particle boards and the analysis of the physical, mechanical and characteristics of the particle boards. Particles of sengon wood are ground using a grinding machine to obtain smaller or finer sized particles. The wood particles are then dried in an oven to reach 5% content. Furthermore, the sengon wood particles were sieved using a 20 mesh sieve to obtain a uniform particle size. Wood particles are mixed with gondorukem adhesive which has been mashed and sieved to a size of 50 mesh with a ratio of 60:40 (m/m). The mixture is then poured into the mold and printed using compression molding with variations in compression time of 10, 15, 20, 25 and 30 minutes and temperature variations in the hot press of 80℃, 90℃, 100℃, 110℃ and 120℃. Analysis of density, moisture content, thickness swelling, water absorption, fracture toughness (MOR), flexural toughness (MOE), fourier transform infrared (FTIR) and scanning electron microscopy (SEM) was carried out on particle board. The treatment of compression temperature variations can improve some of the physical and mechanical properties of particle board. The value of the physical properties of particle board in this study met the SNI 03-2105-2006 standards, namely the parameters of density, moisture content, water absorption and thickness expansion. While the value of mechanical properties that meet the standard SNI 03-2105-2006 is only 2 in the analysis of fracture toughness (Modulus of Rapture) and MOE of flexural toughness (Modulus of Elasticity) at 120℃ with a time of 20 and 25 minutes. Based on the results obtained, particle board treated at 120℃ is particle board with better quality compared to particle board treated with lower temperature variations.
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    https://repositori.usu.ac.id/handle/123456789/82165
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    Repositori Institusi Universitas Sumatera Utara - 2025

    Universitas Sumatera Utara

    Perpustakaan

    Resource Guide

    Katalog Perpustakaan

    Journal Elektronik Berlangganan

    Buku Elektronik Berlangganan

    DSpace software copyright © 2002-2016  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    Atmire NV