| dc.description.abstract | Efforts to increase the heat resistance of materials that are often used in
electronic devices such as Polyvinyl Chloride (PVC) resin are needed to avoid PVC
from decomposing when burned. Materials such as rice husk ash which are known to
contain silicate compounds can be used as fillers which function not only as
reinforcement, but also as thermal stabilizers. Meanwhile, to improve the
compatibility of fillers in the polymer matrix, modifications are generally made with
reactive monomers. In this study, PVC resin modified by reactive monomer methyl
methacrylate with benzoyl peroxide (BPO) as initiator was carried out by reflux
method in tetrahydrofuran (THF) solvent. Optimum conditions are obtained by
varying the composition of the filler. Then, the characterization of the composite
plastic films which included tensile strength tests, SEM, TGA and FTIR. The best
results were composite plastic films with the addition of rice husk ash 50 php with a
tensile strength value of 4.41 MPa, a stretch value of 10.55% and a Young's modulus
value of 0.42 MPa. The results of the SEM morphological analysis showed that PVC- g-MMA with the addition of rice husk ash as filler caused some roughness on the
surface and also the presence of relatively small pores due to the homogeneous
distribution of the filler which indicated compatibility between matrices. and fillers.
The results of the TGA thermal analysis showed that PVC-g-MMA without the
addition of filler as a whole have a weight reduction of 86.96%, and PVC-g-MMA
with the addition of rice husk ash as a filler as a whole have weight reduction of
69.92%. This shows that the sample with the addition of rice husk ash as filler has
better thermal stability properties | en_US |
