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dc.contributor.advisorFrida, Erna
dc.contributor.authorHidayati, Miftah
dc.date.accessioned2024-02-19T03:16:32Z
dc.date.available2024-02-19T03:16:32Z
dc.date.issued2023
dc.identifier.urihttps://repositori.usu.ac.id/handle/123456789/91419
dc.description.abstractThe manufacture of rice husk - coconut fiber and wood sawdust reinforced composite board with epoxy resin has been conducted as an alternative composite material. Rice husk and wood sawdust used are 145 μm and coconut fiber used ± 1 cm. The epoxy adhesive used A (epoxy): B (harderner) is 1:1. The composite boards were molded with hot press felts at a temperature of 90C with a time of 20 minutes. Physical properties testing consisted of density, porosity, and water absorption. Mechanical properties testing consists of Modulus of Elasticity (MOE), compressive strength, and Modulus of Rupture (MOR). The results of testing the physical properties and testing the mechanical properties of the rice husk - coconut fiber and wood sawdust composite board with epoxy resin produced an optimum value at a density of 0.86 g/cm3, porosity of 5.5%, water absorption of 7.30%, Modulus of Elasticity (MOE) 12.5161 MPa, compressive strength of 1.6662 MPa, and Modulus of Rupture (MOR) 13.6933 MPa. The test results of density, porosity, and MOR have met the standards of SNI 03-2105-2006. MOE does not meet the SNI 03-2105-2006 standard. SEM test results on sample C show that the distribution of the mixture is quite even and the distribution of pores is still quite a lot.en_US
dc.language.isoiden_US
dc.publisherUniversitas Sumatera Utaraen_US
dc.subjectComposite Boarden_US
dc.subjectEpoxy Resinen_US
dc.subjectRice Husken_US
dc.subjectCoconut Coir Fiberen_US
dc.subjectWood Sawdusten_US
dc.subjectSDGsen_US
dc.titlePembuatan Papan Komposit diperkuat Sekam Padi -Serat Sabut Kelapa dan Serbuk Gergaji Kayu dengan Resin Epoksien_US
dc.typeThesisen_US
dc.identifier.nimNIM190801053
dc.identifier.nidnNIDN0023016402
dc.identifier.kodeprodiKODEPRODI45201#Fisika
dc.description.pages67 Halamanen_US
dc.description.typeSkripsi Sarjanaen_US


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