Pelapisan Tembaga Menggunakan Titanium Dioksida dengan Metode Electrophoretic Deposition untuk Aplikasi Heat Pipe

Abstract

This study uses the Electrophoretic Deposition method with the synthesis of titanium dioxide to coat copper substrates in suspension with variations in deposition time for 5, 10, 20, and 30 minutes. There were also electrode variations, namely copper with copper, and graphite with copper. The purpose of the titanium dioxide coating on copper is to analyze the potential of the coating on the inner surface of the Cylindrical Heat Pipe as a wick structure. The analysis includes measurement of the mass of particles deposited, thickness analysis using Optical Microscopy, and contact angle test. The results obtained from the analysis of the mass change produced by the titanium dioxide layer attached to the copper plate at 30 minutes produced a mass change of 0.0022 mg, on the Cu vs Cu electrode and 0.0056 mg on the graphite vs Cu electrode. With increasing deposition time, the mass change of the titanium dioxide layer on copper rises. The optimum thickness of the titanium dioxide layer on the copper plate guide was 9.61 μm at 30 min, on Cu vs Cu electrode and 29.16 μm at 30 min on graphite vs Cu electrode. Then Heat Pipe Cylinder coated with titanium dioxide with an input heat of 5 W, and the working fluid used is water in a horizontal direction position. The Heat Pipe Cylinder performance test shows the thermal conductivity produced on the Heat Pipe Cylinder coated with titanium dioxide (218 W/moC). It can be concluded that this research shows the potential application of TiO2 nanofluid in the Electrophoretic Deposition process for copper plating, while the Electrophoretic Deposition method has been proven effective in producing high quality coatings with good time control.