| dc.description.abstract | Particleboard without synthetic adhesives has the opportunity to be developed to replace similar products with synthetic adhesives. Pine wood saw waste has great potential to be used as particle board without synthetic adhesives. The use of pine sawmill waste is still limited to the furniture and household crafts industries and has not been processed into technological products. One alternative binding material can come from vegetable materials, namely gambier-based tannin. Sucrose is a natural ingredient that has potential as a natural adhesive to replace formaldehyde-based synthetic adhesives. This research aims to analyze the physical and mechanical properties of pine particle board using gambier-sucrose adhesive and analyze the influence of the ratio of adhesive materials and compression temperature on the physical and mechanical properties of pine particle board. This research method refers to the Japanese Industrial Standard (JIS) A 5908 (2003) standard with a board size of 25 x 25 x 1 cm. The adhesive used is gambier-sucrose adhesive with two treatment factors, namely the adhesive ratio (25/75, 50/50, 75/25) and compression temperature (180 ℃, 200 ℃), 30% adhesive content, and 35 Mpa compression pressure. for 15 minutes for 3 repetitions. The results of the research show that the ratio of adhesive materials and compression temperature does not have a significant effect on testing the density, water content, water absorption capacity, modulus of rupture, and has a significant effect on testing the thickness development, modulus of elasticity and internal bond of particle board with their respective values. testing, namely, density 0,44-0,51%, water content 8,50-9,87%, water absorption capacity 113,98-191,06%, thickness expansion 11,48-26,10%, modulus of elasticity 155,66-975,86 kgf/cm2, modulus of rupture 1,84-8,14 kgf/cm2, and internal bond 0,06-0,41 kgf/cm2. The physical properties test showed that the density, water content and thickness expansion with an adhesive material ratio of 25/75 with a compression temperature of 200 ℃ met the standards of Japanese Industrial Standard A (2003), while the mechanical properties test did not meet the standards. The best treatment is found in an adhesive material ratio of gambier/sucrose 25/75 with a compression temperature of 200 oC. | en_US |
