Sifat Fisis Mekanis Papan Laminasi Kayu Sengon dan Bambu Belangke Termodifikasi Polistirena
Physical-Mechanical Properties of Laminated Board Sengon Wood and Belangke Bamboo Modified Polystyrene

Date
2024Author
Azz’zahra, Aliya
Advisor(s)
Hartono, Rudi
Sutiawan, Jajang
Metadata
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Sengon wood has low physical and mechanical properties. Efforts are needed to improve the quality of Sengon wood, including making laminated wood with Belangke Bamboo coating. Apart from that, the effort made is chemical modification with polystyrene impregnation. This research aims to analyze the physical and mechanical properties of sengon wood laminated boards with polystyrene-modified belangke bamboo, and also to find out which layer in the treatment of this research gets the optimum value. The raw materials in the form of sengon lamina and belangke bamboo were soaked in polystyrene in a vacuum for 30 minutes and pressed for 30 minutes at a pressure of 6.6 Bar. The laminate board consists of 3 layers measuring 30 cm long x 15 cm wide x 1.5 cm thick. Three types of laminations are made, namely Sengon-Sengon-Sengon; Bamboo-Sengon-Bamboo; Bamboo-Bamboo-Bamboo. The laminate boards that have been made are tested for physical and mechanical properties, namely moisture content, density, percent weight gain, delamination, modulus of elasticity, modulus of rupture and shear strength. The results of testing the physical properties of this research showed that the average value in the weight percent gain test was between 8.18-48.71%, the density had an average value between 0.33-0.81 g/cm3, and the moisture content value ranged from 7.60-9.29%. and 0% delamination. The mechanical properties test results show that the average value of modulus of elasticity (MOE) is 45,562-157,111 kg/cm2, modulus of rupture (MOR) is 472.45-1357.40 kg/cm2, and shear strength is 27.87 -36.68 kg/cm2. In research on laminated boards with a bamboo-bamboo-bamboo laminate arrangement, the most optimal results were obtained in scoring the laminated boards with a total score of 15.
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- Undergraduate Theses [1971]